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Bionanotechnology: Engineering Concepts and Applications - Hardcover

$168.30 USD
$168.30 USD
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Bionanotechnology: Engineering Concepts and Applications - Hardcover
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Product Description

by Jie Chen (Author), Yiwei Feng (Author), Scott MacKay (Author)

Understand the principles, practices, and applications of bionanotechnology

This hands-on textbook covers key aspects of bionanotechnology from an engineering perspective. The book delves into a wide variety of topics, including materials science, micro/nano fabrication, general physics, fluid flow, electromagnetics, thermodynamics, molecular biology, immunology, biochemistry, and organic chemistry.

Developed from an advanced engineering course taught by its authors, Bionanotechnology: Engineering Concepts and Applications fully explains all of the underlying concepts and shows how that theory can be directly applied in practical applications. Readers will get examples, problem sets, real-world case studies, and engineering design methodologies that illustrate each concept.

The book contains complete discussions on microfluidics, lab-on-a-chip devices, organ-on-a-chip devices, quantum dots, DNA/RNA technology, micro/nano fabrication techniques, the modelling/simulation of microsystems, and bionanotechnology-based biosensors, targeted therapies, and drug delivery systems.

  • Combines many different bionanotechnology topics into one resource
  • Based on a course developed and taught by the authors at the University of Alberta
  • Written by recognized experts and experienced educators

Author Biography

Jie Chen, Ph.D., is a professor in the faculty of engineering at the University of Alberta, Edmonton, AB, Canada. He has coauthored two books, 78 peer-reviewed journal papers, and 70 peer-reviewed conference proceeding papers.

Scott McKay, is a graduate student in Dr. Jie Chen's lab in the University of Alberta, Edmonton, AB, Canada. He has been a teacher's assistant for the course on which this book has been based.
Number of Pages: 384
Dimensions: 1 x 10.2 x 7.9 IN
Publication Date: May 30, 2022
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