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3D Platform Uplifts Student Competency for Placement - Paperback

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3D Platform Uplifts Student Competency for Placement - Paperback
3D Platform Uplifts Student Competency for Placement - Paperback
3D Platform Uplifts Student Competency for Placement - Paperback
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Product Description

by Raj Mehta (Author)


The title of the book is 3 D PLATFORM UPLIFTS STUDENTS COMPETENCY FOR PLACEMENT. This is a simple, systematic and logical technique which is applicable to MBA and BBA students who undergo management courses with an aim to be suitably placed.

In keeping with the drastic changes, a sort of revolution in the fields of management and technology, and wide range of opportunities available for students to learn has lead to a high degree of competition and dynamic and challenging environment which poses direct impact on students' placement opportunities.

In this book, a unique approach is applied, which initially introduces managerial skills to students with the view to clear the fundamental concepts. The students are subsequently put into the next process of adding value in these skills to understand the practical application in business operations.

This book introduces new methods like, classroom learning, self-development, knowledge folder, group formation, looking beyond syllabus, creating own library, summer training projects, etc. These activities create a positive environment, inducing a self-motivation culture among the students to put in their best.

Distinguishing features of this book:

Various managerial skills and business operations are explained on different 3D platforms. The student has to select the appropriate platform which automatically guides the student through the complete process of developing competency.

The method of selecting the platform is provided in this book.

In addition, this book explains the placement process, student placement strategy, interview management and how a student can justify competency level in the interview for the applied job profile.

Number of Pages: 78
Dimensions: 0.19 x 9 x 6 IN
Publication Date: December 20, 2019
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